Task 450143206

Name ps_240222_input_5465_71_1
Workunit 199408612
Created 23 Feb 2024, 13:29:22 UTC
Sent 1 Mar 2024, 16:39:08 UTC
Report deadline 12 Mar 2024, 4:39:08 UTC
Received 8 Mar 2024, 12:48:02 UTC
Server state Over
Outcome Success
Client state Done
Exit status 0 (0x00000000)
Computer ID 764021
Run time 6 hours 29 min 25 sec
CPU time 22 sec
Validate state Valid
Credit 68.46
Device peak FLOPS 92.50 GFLOPS
Application version Period Search Application v102.20 (opencl_102_amd_win)
windows_x86_64
Peak working set size 1,010.35 MB
Peak swap size 1.31 GB
Peak disk usage 2.05 MB

Stderr output

<core_client_version>7.24.1</core_client_version>
<![CDATA[
<stderr_txt>
BOINC client version 7.24.1
BOINC GPU type 'ATI', deviceId=0, slot=0
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Binary build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
05:09:23 (22128): called boinc_finish(0)

</stderr_txt>
]]>