Task 466581199

Name	ps_240412_input_34961_67_1
Workunit	207295516
Created	13 Apr 2024, 16:37:13 UTC
Sent	17 Apr 2024, 21:01:45 UTC
Report deadline	28 Apr 2024, 9:01:45 UTC
Received	18 Apr 2024, 6:21:05 UTC
Server state	Over
Outcome	Success
Client state	Done
Exit status	0 (0x00000000)
Computer ID	762227
Run time	2 hours 8 min 7 sec
CPU time	6 sec
Validate state	Valid
Credit	71.23
Device peak FLOPS	1,039.35 GFLOPS
Application version	Period Search Application v102.20 (opencl_102_amd_win) windows_x86_64
Peak working set size	4.52 GB
Peak swap size	4.58 GB
Peak disk usage	2.06 MB

Stderr output

<core_client_version>7.16.20</core_client_version>
<![CDATA[
<stderr_txt>
BOINC client version 7.16.20
BOINC GPU type 'ATI', deviceId=0, slot=1
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3380.6)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3380.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Binary build log for Radeon RX 570 Series:
OK (0)
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3380.6)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3380.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3380.6)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3380.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3380.6)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3380.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3380.6)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3380.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3380.6)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3380.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3380.6)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3380.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3380.6)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3380.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
12:45:11 (33800): called boinc_finish(0)

</stderr_txt>
]]>