Task 467626788

Name	ps_240412_input_41064_13_1
Workunit	207817516
Created	13 Apr 2024, 19:34:56 UTC
Sent	21 Apr 2024, 10:47:15 UTC
Report deadline	1 May 2024, 22:47:15 UTC
Received	23 Apr 2024, 16:05:32 UTC
Server state	Over
Outcome	Success
Client state	Done
Exit status	0 (0x00000000)
Computer ID	707360
Run time	41 min 13 sec
CPU time	6 sec
Validate state	Valid
Credit	63.20
Device peak FLOPS	439.83 GFLOPS
Application version	Period Search Application v102.20 (opencl_102_amd_win) windows_x86_64
Peak working set size	2.11 GB
Peak swap size	3.23 GB
Peak disk usage	2.11 MB

Stderr output

<core_client_version>7.24.1</core_client_version>
<![CDATA[
<stderr_txt>
BOINC client version 7.24.1
BOINC GPU type 'ATI', deviceId=0, slot=0
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Binary build log for Radeon RX 560 Series:
OK (0)
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version:Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
18:05:17 (15656): called boinc_finish(0)

</stderr_txt>
]]>