Task 474279856

Name ps_240506_input_84511_16_0
Workunit 211033890
Created 8 May 2024, 2:11:30 UTC
Sent 15 May 2024, 13:56:10 UTC
Report deadline 26 May 2024, 1:56:10 UTC
Received 16 May 2024, 6:34:44 UTC
Server state Over
Outcome Success
Client state Done
Exit status 0 (0x00000000)
Computer ID 671257
Run time 1 hours 6 min 9 sec
CPU time 10 sec
Validate state Valid
Credit 66.74
Device peak FLOPS 385.65 GFLOPS
Application version Period Search Application v102.20 (opencl_102_amd_win)
windows_x86_64
Peak working set size 2.30 GB
Peak swap size 3.20 GB
Peak disk usage 2.11 MB

Stderr output

<core_client_version>7.16.7</core_client_version>
<![CDATA[
<stderr_txt>
BOINC client version 7.16.7
BOINC GPU type 'ATI', deviceId=0, slot=0
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (2442.9)
OpenCL device Id: 0
OpenCL device name: AMD Radeon R7 200 Series 2GB
Device driver version: 2442.9
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Binary build log for AMD Radeon R7 200 Series:
OK (0)
Program build log for AMD Radeon R7 200 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (2442.9)
OpenCL device Id: 0
OpenCL device name: AMD Radeon R7 200 Series 2GB
Device driver version: 2442.9
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for AMD Radeon R7 200 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (2442.9)
OpenCL device Id: 0
OpenCL device name: AMD Radeon R7 200 Series 2GB
Device driver version: 2442.9
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for AMD Radeon R7 200 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (2442.9)
OpenCL device Id: 0
OpenCL device name: AMD Radeon R7 200 Series 2GB
Device driver version: 2442.9
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for AMD Radeon R7 200 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
07:33:41 (4416): called boinc_finish(0)

</stderr_txt>
]]>