Task 483303876
| Name | ps_240611_input_104912_55_1 |
| Workunit | 215268877 |
| Created | 12 Jun 2024, 5:00:55 UTC |
| Sent | 14 Jun 2024, 19:07:58 UTC |
| Report deadline | 25 Jun 2024, 7:07:58 UTC |
| Received | 14 Jun 2024, 21:27:16 UTC |
| Server state | Over |
| Outcome | Success |
| Client state | Done |
| Exit status | 0 (0x00000000) |
| Computer ID | 763903 |
| Run time | 31 min 7 sec |
| CPU time | 14 sec |
| Validate state | Valid |
| Credit | 66.74 |
| Device peak FLOPS | 1,149.28 GFLOPS |
| Application version | Period Search Application v102.20 (opencl_102_amd_win) windows_x86_64 |
| Peak working set size | 1.56 GB |
| Peak swap size | 3.34 GB |
| Peak disk usage | 2.09 MB |
Stderr output
<core_client_version>8.0.2</core_client_version> <![CDATA[ <stderr_txt> BOINC client version 8.0.2 BOINC GPU type 'ATI', deviceId=0, slot=6 Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe Version: 102.20.0.0 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 4GB Device driver version: 3240.7 Multiprocessors: 44 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 1408 = 2 * 44 * 16 Block dim: 128 Binary build log for AMD Radeon R9 200 Series: OK (0) Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 4GB Device driver version: 3240.7 Multiprocessors: 44 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 1408 = 2 * 44 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 4GB Device driver version: 3240.7 Multiprocessors: 44 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 1408 = 2 * 44 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 4GB Device driver version: 3240.7 Multiprocessors: 44 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 1408 = 2 * 44 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 13:26:38 (1792): called boinc_finish(0) </stderr_txt> ]]>