Task 498824350

Name ps_240803_input_24171_55_1
Workunit 222751599
Created 5 Aug 2024, 0:41:33 UTC
Sent 12 Aug 2024, 9:46:51 UTC
Report deadline 22 Aug 2024, 21:46:51 UTC
Received 18 Aug 2024, 12:29:28 UTC
Server state Over
Outcome Success
Client state Done
Exit status 0 (0x00000000)
Computer ID 707360
Run time 50 min 24 sec
CPU time 10 sec
Validate state Valid
Credit 48.77
Device peak FLOPS 439.84 GFLOPS
Application version Period Search Application v102.20 (opencl_102_amd_win)
windows_x86_64
Peak working set size 1.57 GB
Peak swap size 3.22 GB
Peak disk usage 2.04 MB

Stderr output

<core_client_version>8.0.2</core_client_version>
<![CDATA[
<stderr_txt>
BOINC client version 8.0.2
BOINC GPU type 'ATI', deviceId=0, slot=12
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Binary build log for Radeon RX 560 Series:
OK (0)
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 14
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 448 = 2 * 14 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
14:29:14 (13780): called boinc_finish(0)

</stderr_txt>
]]>