Task 502147799
| Name | ps_240812_input_26525_77_2 |
| Workunit | 223025944 |
| Created | 25 Aug 2024, 0:34:46 UTC |
| Sent | 25 Aug 2024, 0:34:49 UTC |
| Report deadline | 4 Sep 2024, 12:34:49 UTC |
| Received | 25 Aug 2024, 7:06:09 UTC |
| Server state | Over |
| Outcome | Success |
| Client state | Done |
| Exit status | 0 (0x00000000) |
| Computer ID | 638321 |
| Run time | 2 hours 19 min 33 sec |
| CPU time | 13 sec |
| Validate state | Invalid |
| Credit | 0.00 |
| Device peak FLOPS | 161.72 GFLOPS |
| Application version | Period Search Application v102.20 (opencl_102_amd_win) windows_x86_64 |
| Peak working set size | 1.44 GB |
| Peak swap size | 2.42 GB |
| Peak disk usage | 1.81 MB |
Stderr output
<core_client_version>8.0.2</core_client_version> <![CDATA[ <stderr_txt> BOINC client version 8.0.2 BOINC GPU type 'ATI', deviceId=0, slot=12 Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe Version: 102.20.0.0 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (2482.5) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) R7 250 2GB Device driver version: 2482.5 Multiprocessors: 6 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 192 = 2 * 6 * 16 Block dim: 128 Binary build log for AMD Radeon(TM) R7 250: OK (0) Program build log for AMD Radeon(TM) R7 250: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (2482.5) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) R7 250 2GB Device driver version: 2482.5 Multiprocessors: 6 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 192 = 2 * 6 * 16 Block dim: 128 Program build log for AMD Radeon(TM) R7 250: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (2482.5) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) R7 250 2GB Device driver version: 2482.5 Multiprocessors: 6 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 192 = 2 * 6 * 16 Block dim: 128 Program build log for AMD Radeon(TM) R7 250: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (2482.5) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) R7 250 2GB Device driver version: 2482.5 Multiprocessors: 6 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 192 = 2 * 6 * 16 Block dim: 128 Program build log for AMD Radeon(TM) R7 250: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (2482.5) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) R7 250 2GB Device driver version: 2482.5 Multiprocessors: 6 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 192 = 2 * 6 * 16 Block dim: 128 Program build log for AMD Radeon(TM) R7 250: OK (0) Prefered kernel work group size multiple: 64 02:05:58 (6372): called boinc_finish(0) </stderr_txt> ]]>