Task 504774284
Name | ps_240826_input_54608_52_1 |
Workunit | 225634811 |
Created | 27 Aug 2024, 10:47:26 UTC |
Sent | 5 Sep 2024, 16:50:17 UTC |
Report deadline | 16 Sep 2024, 4:50:17 UTC |
Received | 6 Sep 2024, 4:09:43 UTC |
Server state | Over |
Outcome | Success |
Client state | Done |
Exit status | 0 (0x00000000) |
Computer ID | 780218 |
Run time | 5 hours 57 min 37 sec |
CPU time | 14 sec |
Validate state | Valid |
Credit | 65.61 |
Device peak FLOPS | 92.26 GFLOPS |
Application version | Period Search Application v102.20 (opencl_102_amd_win) windows_x86_64 |
Peak working set size | 1.30 GB |
Peak swap size | 1.32 GB |
Peak disk usage | 2.07 MB |
Stderr output
<core_client_version>8.0.2</core_client_version> <![CDATA[ <stderr_txt> BOINC client version 8.0.2 BOINC GPU type 'ATI', deviceId=0, slot=6 Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe Version: 102.20.0.0 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3302.6) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 4GB Device driver version: 3302.6 (PAL,HSAIL) Multiprocessors: 3 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 96 = 2 * 3 * 16 Block dim: 128 Binary build log for AMD Radeon(TM) Vega 3 Graphics: OK (0) Program build log for AMD Radeon(TM) Vega 3 Graphics: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3302.6) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 4GB Device driver version: 3302.6 (PAL,HSAIL) Multiprocessors: 3 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 96 = 2 * 3 * 16 Block dim: 128 Program build log for AMD Radeon(TM) Vega 3 Graphics: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3302.6) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 4GB Device driver version: 3302.6 (PAL,HSAIL) Multiprocessors: 3 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 96 = 2 * 3 * 16 Block dim: 128 Program build log for AMD Radeon(TM) Vega 3 Graphics: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3302.6) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 4GB Device driver version: 3302.6 (PAL,HSAIL) Multiprocessors: 3 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 96 = 2 * 3 * 16 Block dim: 128 Program build log for AMD Radeon(TM) Vega 3 Graphics: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3302.6) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 4GB Device driver version: 3302.6 (PAL,HSAIL) Multiprocessors: 3 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 96 = 2 * 3 * 16 Block dim: 128 Program build log for AMD Radeon(TM) Vega 3 Graphics: OK (0) Prefered kernel work group size multiple: 64 22:09:12 (2672): called boinc_finish(0) </stderr_txt> ]]>