Task 510085020
Name | ps_240907_input_96083_18_0 |
Workunit | 228234721 |
Created | 9 Sep 2024, 7:08:38 UTC |
Sent | 25 Sep 2024, 12:50:48 UTC |
Report deadline | 6 Oct 2024, 0:50:48 UTC |
Received | 26 Sep 2024, 18:41:44 UTC |
Server state | Over |
Outcome | Success |
Client state | Done |
Exit status | 0 (0x00000000) |
Computer ID | 781364 |
Run time | 4 hours 9 min 23 sec |
CPU time | 19 sec |
Validate state | Valid |
Credit | 64.02 |
Device peak FLOPS | 84.66 GFLOPS |
Application version | Period Search Application v102.20 (opencl_102_amd_win) windows_x86_64 |
Peak working set size | 681.60 MB |
Peak swap size | 1.34 GB |
Peak disk usage | 2.24 MB |
Stderr output
<core_client_version>8.0.2</core_client_version> <![CDATA[ <stderr_txt> BOINC client version 8.0.2 BOINC GPU type 'ATI', deviceId=0, slot=0 Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe Version: 102.20.0.0 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3584.0) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 4GB Device driver version: 3584.0 (PAL,HSAIL) Multiprocessors: 3 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 96 = 2 * 3 * 16 Block dim: 128 Binary build log for AMD Radeon(TM) Vega 3 Graphics: OK (0) Program build log for AMD Radeon(TM) Vega 3 Graphics: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3584.0) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 4GB Device driver version: 3584.0 (PAL,HSAIL) Multiprocessors: 3 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 96 = 2 * 3 * 16 Block dim: 128 Program build log for AMD Radeon(TM) Vega 3 Graphics: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3584.0) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 4GB Device driver version: 3584.0 (PAL,HSAIL) Multiprocessors: 3 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 96 = 2 * 3 * 16 Block dim: 128 Program build log for AMD Radeon(TM) Vega 3 Graphics: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3584.0) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 4GB Device driver version: 3584.0 (PAL,HSAIL) Multiprocessors: 3 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 96 = 2 * 3 * 16 Block dim: 128 Program build log for AMD Radeon(TM) Vega 3 Graphics: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3584.0) OpenCL device Id: 0 OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 4GB Device driver version: 3584.0 (PAL,HSAIL) Multiprocessors: 3 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 96 = 2 * 3 * 16 Block dim: 128 Program build log for AMD Radeon(TM) Vega 3 Graphics: OK (0) Prefered kernel work group size multiple: 64 14:17:20 (4224): called boinc_finish(0) </stderr_txt> ]]>