Task 510135256

Name ps_240907_input_96614_15_0
Workunit 228259818
Created 9 Sep 2024, 7:18:00 UTC
Sent 25 Sep 2024, 16:42:57 UTC
Report deadline 6 Oct 2024, 4:42:57 UTC
Received 27 Sep 2024, 18:59:58 UTC
Server state Over
Outcome Success
Client state Done
Exit status 0 (0x00000000)
Computer ID 752743
Run time 24 min 11 sec
CPU time 5 sec
Validate state Valid
Credit 52.84
Device peak FLOPS 988.46 GFLOPS
Application version Period Search Application v102.20 (opencl_102_amd_win)
windows_x86_64
Peak working set size 2.55 GB
Peak swap size 3.31 GB
Peak disk usage 2.09 MB

Stderr output

<core_client_version>8.0.2</core_client_version>
<![CDATA[
<stderr_txt>
BOINC client version 8.0.2
BOINC GPU type 'ATI', deviceId=0, slot=1
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Binary build log for Radeon (TM) RX 570:
OK (0)
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
BOINC client version 8.0.2
BOINC GPU type 'ATI', deviceId=0, slot=1
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
BOINC client version 8.0.2
BOINC GPU type 'ATI', deviceId=0, slot=1
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
BOINC client version 8.0.2
BOINC GPU type 'ATI', deviceId=0, slot=1
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3302.6)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3302.6 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
20:52:44 (14488): called boinc_finish(0)

</stderr_txt>
]]>