Task 516272557

Name ps_241013_input_7073_214_0
Workunit 231014385
Created 13 Oct 2024, 23:41:17 UTC
Sent 17 Oct 2024, 18:53:23 UTC
Report deadline 28 Oct 2024, 6:53:23 UTC
Received 19 Oct 2024, 14:18:34 UTC
Server state Over
Outcome Success
Client state Done
Exit status 0 (0x00000000)
Computer ID 562427
Run time 4 hours 41 min 10 sec
CPU time 31 sec
Validate state Valid
Credit 52.16
Device peak FLOPS 84.95 GFLOPS
Application version Period Search Application v102.20 (opencl_102_amd_win)
windows_x86_64
Peak working set size 1.19 GB
Peak swap size 1.78 GB
Peak disk usage 2.03 MB

Stderr output

<core_client_version>7.22.2</core_client_version>
<![CDATA[
<stderr_txt>
BOINC client version 7.22.2
BOINC GPU type 'ATI', deviceId=0, slot=2
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 1GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Binary build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 1GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 1GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 1GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 1GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
15:35:39 (10108): called boinc_finish(0)

</stderr_txt>
]]>