Task 520428067
Name | ps_241028_input_16858_24_0 |
Workunit | 233002277 |
Created | 29 Oct 2024, 5:41:59 UTC |
Sent | 1 Nov 2024, 14:47:55 UTC |
Report deadline | 12 Nov 2024, 2:47:55 UTC |
Received | 4 Nov 2024, 17:16:24 UTC |
Server state | Over |
Outcome | Success |
Client state | Done |
Exit status | 0 (0x00000000) |
Computer ID | 782590 |
Run time | 40 min 39 sec |
CPU time | 10 sec |
Validate state | Valid |
Credit | 48.06 |
Device peak FLOPS | 489.98 GFLOPS |
Application version | Period Search Application v102.20 (opencl_102_amd_win) windows_x86_64 |
Peak working set size | 1.57 GB |
Peak swap size | 3.25 GB |
Peak disk usage | 2.05 MB |
Stderr output
<core_client_version>8.0.2</core_client_version> <![CDATA[ <stderr_txt> BOINC client version 8.0.2 BOINC GPU type 'ATI', deviceId=0, slot=7 Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe Version: 102.20.0.0 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3444.0) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 4GB Device driver version: 3444.0 (PAL,HSAIL) Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Binary build log for Radeon RX 560 Series: OK (0) Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3444.0) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 4GB Device driver version: 3444.0 (PAL,HSAIL) Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3444.0) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 4GB Device driver version: 3444.0 (PAL,HSAIL) Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3444.0) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 4GB Device driver version: 3444.0 (PAL,HSAIL) Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3444.0) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 4GB Device driver version: 3444.0 (PAL,HSAIL) Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3444.0) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 4GB Device driver version: 3444.0 (PAL,HSAIL) Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3444.0) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 4GB Device driver version: 3444.0 (PAL,HSAIL) Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3444.0) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 4GB Device driver version: 3444.0 (PAL,HSAIL) Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3444.0) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 4GB Device driver version: 3444.0 (PAL,HSAIL) Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 10:45:53 (3448): called boinc_finish(0) </stderr_txt> ]]>