Task 522514441

Name ps_241104_input_22445_2_0
Workunit 234007430
Created 5 Nov 2024, 17:36:51 UTC
Sent 8 Nov 2024, 13:21:27 UTC
Report deadline 19 Nov 2024, 1:21:27 UTC
Received 11 Nov 2024, 15:17:16 UTC
Server state Over
Outcome Success
Client state Done
Exit status 0 (0x00000000)
Computer ID 782590
Run time 40 min 59 sec
CPU time 13 sec
Validate state Valid
Credit 48.00
Device peak FLOPS 489.98 GFLOPS
Application version Period Search Application v102.20 (opencl_102_amd_win)
windows_x86_64
Peak working set size 2.39 GB
Peak swap size 3.25 GB
Peak disk usage 2.05 MB

Stderr output

<core_client_version>8.0.2</core_client_version>
<![CDATA[
<stderr_txt>
BOINC client version 8.0.2
BOINC GPU type 'ATI', deviceId=0, slot=1
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3444.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3444.0 (PAL,HSAIL)
Multiprocessors: 16
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 512 = 2 * 16 * 16
Block dim: 128
Binary build log for Radeon RX 560 Series:
OK (0)
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3444.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3444.0 (PAL,HSAIL)
Multiprocessors: 16
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 512 = 2 * 16 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3444.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3444.0 (PAL,HSAIL)
Multiprocessors: 16
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 512 = 2 * 16 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3444.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3444.0 (PAL,HSAIL)
Multiprocessors: 16
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 512 = 2 * 16 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3444.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3444.0 (PAL,HSAIL)
Multiprocessors: 16
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 512 = 2 * 16 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3444.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3444.0 (PAL,HSAIL)
Multiprocessors: 16
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 512 = 2 * 16 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3444.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3444.0 (PAL,HSAIL)
Multiprocessors: 16
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 512 = 2 * 16 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3444.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3444.0 (PAL,HSAIL)
Multiprocessors: 16
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 512 = 2 * 16 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3444.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3444.0 (PAL,HSAIL)
Multiprocessors: 16
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 512 = 2 * 16 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
09:00:51 (17920): called boinc_finish(0)

</stderr_txt>
]]>