Task 524609035

Name ps_241104_input_29115_79_0
Workunit 235053001
Created 6 Nov 2024, 4:02:22 UTC
Sent 14 Nov 2024, 20:28:31 UTC
Report deadline 25 Nov 2024, 8:28:31 UTC
Received 15 Nov 2024, 16:16:09 UTC
Server state Over
Outcome Success
Client state Done
Exit status 0 (0x00000000)
Computer ID 782590
Run time 44 min 48 sec
CPU time 19 sec
Validate state Valid
Credit 51.89
Device peak FLOPS 489.98 GFLOPS
Application version Period Search Application v102.20 (opencl_102_amd_win)
windows_x86_64
Peak working set size 1.57 GB
Peak swap size 3.25 GB
Peak disk usage 2.07 MB

Stderr output

<core_client_version>8.0.2</core_client_version>
<![CDATA[
<stderr_txt>
BOINC client version 8.0.2
BOINC GPU type 'ATI', deviceId=0, slot=1
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3444.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3444.0 (PAL,HSAIL)
Multiprocessors: 16
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 512 = 2 * 16 * 16
Block dim: 128
Binary build log for Radeon RX 560 Series:
OK (0)
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
BOINC client version 8.0.2
BOINC GPU type 'ATI', deviceId=0, slot=1
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3444.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3444.0 (PAL,HSAIL)
Multiprocessors: 16
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 512 = 2 * 16 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3444.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3444.0 (PAL,HSAIL)
Multiprocessors: 16
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 512 = 2 * 16 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3444.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 560 Series 4GB
Device driver version: 3444.0 (PAL,HSAIL)
Multiprocessors: 16
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 512 = 2 * 16 * 16
Block dim: 128
Program build log for Radeon RX 560 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
09:15:40 (11728): called boinc_finish(0)

</stderr_txt>
]]>