Task 526794007
| Name | ps_241114_input_36196_94_1 |
| Workunit | 236101246 |
| Created | 15 Nov 2024, 12:53:24 UTC |
| Sent | 21 Nov 2024, 15:57:02 UTC |
| Report deadline | 2 Dec 2024, 3:57:02 UTC |
| Received | 21 Nov 2024, 19:16:56 UTC |
| Server state | Over |
| Outcome | Success |
| Client state | Done |
| Exit status | 0 (0x00000000) |
| Computer ID | 782590 |
| Run time | 49 min 16 sec |
| CPU time | 22 sec |
| Validate state | Valid |
| Credit | 54.70 |
| Device peak FLOPS | 489.98 GFLOPS |
| Application version | Period Search Application v102.20 (opencl_102_amd_win) windows_x86_64 |
| Peak working set size | 1.57 GB |
| Peak swap size | 3.25 GB |
| Peak disk usage | 2.03 MB |
Stderr output
<core_client_version>8.0.2</core_client_version> <![CDATA[ <stderr_txt> BOINC client version 8.0.2 BOINC GPU type 'ATI', deviceId=0, slot=7 Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe Version: 102.20.0.0 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3444.0) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 4GB Device driver version: 3444.0 (PAL,HSAIL) Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Binary build log for Radeon RX 560 Series: OK (0) Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3444.0) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 4GB Device driver version: 3444.0 (PAL,HSAIL) Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3444.0) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 4GB Device driver version: 3444.0 (PAL,HSAIL) Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3444.0) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 4GB Device driver version: 3444.0 (PAL,HSAIL) Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 13:16:45 (11636): called boinc_finish(0) </stderr_txt> ]]>