Task 527153404
| Name | ps_241114_input_37601_117_0 |
| Workunit | 236280397 |
| Created | 15 Nov 2024, 14:26:09 UTC |
| Sent | 22 Nov 2024, 18:22:53 UTC |
| Report deadline | 3 Dec 2024, 6:22:53 UTC |
| Received | 25 Nov 2024, 11:56:44 UTC |
| Server state | Over |
| Outcome | Success |
| Client state | Done |
| Exit status | 0 (0x00000000) |
| Computer ID | 765330 |
| Run time | 31 min 57 sec |
| CPU time | 14 sec |
| Validate state | Valid |
| Credit | 52.26 |
| Device peak FLOPS | 563.65 GFLOPS |
| Application version | Period Search Application v102.20 (opencl_102_amd_win) windows_x86_64 |
| Peak working set size | 3.01 GB |
| Peak swap size | 4.55 GB |
| Peak disk usage | 2.24 MB |
Stderr output
<core_client_version>7.24.1</core_client_version> <![CDATA[ <stderr_txt> BOINC client version 7.24.1 BOINC GPU type 'ATI', deviceId=0, slot=0 Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe Version: 102.20.0.0 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 20 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 640 = 2 * 20 * 16 Block dim: 128 Binary build log for AMD Radeon R9 200 Series: OK (0) Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 20 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 640 = 2 * 20 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 20 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 640 = 2 * 20 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 20 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 640 = 2 * 20 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 20 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 640 = 2 * 20 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 11:55:48 (9904): called boinc_finish(0) </stderr_txt> ]]>