Task 530252613

Name ps_241124_input_49795_95_0
Workunit 237772971
Created 27 Nov 2024, 4:33:54 UTC
Sent 7 Dec 2024, 3:18:27 UTC
Report deadline 17 Dec 2024, 15:18:27 UTC
Received 12 Dec 2024, 20:50:13 UTC
Server state Over
Outcome Success
Client state Done
Exit status 0 (0x00000000)
Computer ID 769924
Run time 31 min 23 sec
CPU time 18 sec
Validate state Valid
Credit 54.16
Device peak FLOPS 1,019.37 GFLOPS
Application version Period Search Application v102.20 (opencl_102_amd_win)
windows_x86_64
Peak working set size 2.95 GB
Peak swap size 3.24 GB
Peak disk usage 2.06 MB

Stderr output

<core_client_version>8.0.2</core_client_version>
<![CDATA[
<stderr_txt>
BOINC client version 8.0.2
BOINC GPU type 'ATI', deviceId=0, slot=7
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Binary build log for Radeon RX 570 Series:
OK (0)
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon RX 570 Series 4GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon RX 570 Series:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
20:49:30 (10304): called boinc_finish(0)

</stderr_txt>
]]>