Task 567891931
| Name | ps_250406_input_202_77_0 |
| Workunit | 255805992 |
| Created | 7 Apr 2025, 4:20:52 UTC |
| Sent | 10 Apr 2025, 1:05:44 UTC |
| Report deadline | 20 Apr 2025, 13:05:44 UTC |
| Received | 13 Apr 2025, 5:27:09 UTC |
| Server state | Over |
| Outcome | Success |
| Client state | Done |
| Exit status | 0 (0x00000000) |
| Computer ID | 764056 |
| Run time | 39 min |
| CPU time | 13 sec |
| Validate state | Valid |
| Credit | 35.78 |
| Device peak FLOPS | 418.23 GFLOPS |
| Application version | Period Search Application v102.20 (opencl_102_amd_win) windows_x86_64 |
| Peak working set size | 2.02 GB |
| Peak swap size | 3.23 GB |
| Peak disk usage | 2.21 MB |
Stderr output
<core_client_version>7.24.1</core_client_version> <![CDATA[ <stderr_txt> BOINC client version 7.24.1 BOINC GPU type 'ATI', deviceId=0, slot=1 Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe Version: 102.20.0.0 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon (TM) R7 370 Series 2GB Device driver version: 3240.7 Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Binary build log for AMD Radeon (TM) R7 370 Series: OK (0) Program build log for AMD Radeon (TM) R7 370 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon (TM) R7 370 Series 2GB Device driver version: 3240.7 Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Program build log for AMD Radeon (TM) R7 370 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon (TM) R7 370 Series 2GB Device driver version: 3240.7 Multiprocessors: 16 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 512 = 2 * 16 * 16 Block dim: 128 Program build log for AMD Radeon (TM) R7 370 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 01:27:06 (6492): called boinc_finish(0) </stderr_txt> ]]>