Task 581043655
| Name | ps_250603_input_90703_92_0 |
| Workunit | 262086963 |
| Created | 3 Jun 2025, 11:16:36 UTC |
| Sent | 5 Jun 2025, 9:32:23 UTC |
| Report deadline | 15 Jun 2025, 21:32:23 UTC |
| Received | 5 Jun 2025, 18:55:36 UTC |
| Server state | Over |
| Outcome | Success |
| Client state | Done |
| Exit status | 0 (0x00000000) |
| Computer ID | 792101 |
| Run time | 1 hours 14 min |
| CPU time | 8 sec |
| Validate state | Valid |
| Credit | 59.53 |
| Device peak FLOPS | 439.84 GFLOPS |
| Application version | Period Search Application v102.20 (opencl_102_amd_win) windows_x86_64 |
| Peak working set size | 2.18 GB |
| Peak swap size | 3.23 GB |
| Peak disk usage | 2.05 MB |
Stderr output
<core_client_version>7.16.7</core_client_version> <![CDATA[ <stderr_txt> BOINC client version 7.16.7 BOINC GPU type 'ATI', deviceId=0, slot=0 Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe Version: 102.20.0.0 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3302.6) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 2GB Device driver version: 3302.6 (PAL,HSAIL) Multiprocessors: 14 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 448 = 2 * 14 * 16 Block dim: 128 Binary build log for Radeon RX 560 Series: OK (0) Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3302.6) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 2GB Device driver version: 3302.6 (PAL,HSAIL) Multiprocessors: 14 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 448 = 2 * 14 * 16 Block dim: 128 Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 2.0 | OpenCL 2.0 AMD-APP (3302.6) OpenCL device Id: 0 OpenCL device name: Radeon RX 560 Series 2GB Device driver version: 3302.6 (PAL,HSAIL) Multiprocessors: 14 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 448 = 2 * 14 * 16 Block dim: 128 Program build log for Radeon RX 560 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 19:55:14 (3832): called boinc_finish(0) </stderr_txt> ]]>