Task 595434784

Name ps_250725_input_88859_2_5
Workunit 268534649
Created 11 Aug 2025, 6:58:46 UTC
Sent 11 Aug 2025, 6:58:49 UTC
Report deadline 17 Aug 2025, 1:52:09 UTC
Received 14 Aug 2025, 20:27:03 UTC
Server state Over
Outcome Computation error
Client state Compute error
Exit status 2 (0x00000002) Unknown error code
Computer ID 809391
Run time 26 min 37 sec
CPU time 29 sec
Validate state Invalid
Credit 0.00
Device peak FLOPS 92.69 GFLOPS
Application version Period Search Application v102.20 (opencl_102_amd_win)
windows_x86_64
Peak working set size 1.68 GB
Peak swap size 1.77 GB
Peak disk usage 2.23 MB

Stderr output

<core_client_version>8.2.4</core_client_version>
<![CDATA[
<message>
Le fichier sp�cifi� est introuvable.
 (0x2) - exit code 2 (0x2)</message>
<stderr_txt>
BOINC client version 8.2.4
BOINC GPU type 'ATI', deviceId=0, slot=0
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3075.13)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 6GB
Device driver version: 3075.13 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Binary build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3075.13)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 6GB
Device driver version: 3075.13 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3075.13)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 6GB
Device driver version: 3075.13 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3075.13)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 6GB
Device driver version: 3075.13 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3075.13)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 6GB
Device driver version: 3075.13 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3075.13)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 6GB
Device driver version: 3075.13 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3075.13)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 6GB
Device driver version: 3075.13 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3075.13)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 6GB
Device driver version: 3075.13 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
Program build log for AMD Radeon(TM) Vega 3 Graphics:
OK (0)
Prefered kernel work group size multiple: 64
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3075.13)
OpenCL device Id: 0
OpenCL device name: AMD Radeon(TM) Vega 3 Graphics 6GB
Device driver version: 3075.13 (PAL,HSAIL)
Multiprocessors: 3
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 96 = 2 * 3 * 16
Block dim: 128
 Error creating queue: out of host memory(-6)

</stderr_txt>
]]>