Task 622532581
| Name | ps_251106a_input_31549_1_0 |
| Workunit | 281594254 |
| Created | 7 Nov 2025, 4:23:59 UTC |
| Sent | 11 Nov 2025, 14:54:30 UTC |
| Report deadline | 22 Nov 2025, 2:54:30 UTC |
| Received | 13 Nov 2025, 7:26:18 UTC |
| Server state | Over |
| Outcome | Success |
| Client state | Done |
| Exit status | 0 (0x00000000) |
| Computer ID | 816873 |
| Run time | 2 hours 35 min 53 sec |
| CPU time | 23 sec |
| Validate state | Valid |
| Credit | 53.43 |
| Device peak FLOPS | 105.54 GFLOPS |
| Application version | Period Search Application v102.20 (opencl_102_amd_win) windows_x86_64 |
| Peak working set size | 1.02 GB |
| Peak swap size | 2.06 GB |
| Peak disk usage | 2.22 MB |
Stderr output
<core_client_version>8.2.4</core_client_version> <![CDATA[ <stderr_txt> BOINC client version 8.2.4 BOINC GPU type 'ATI', deviceId=0, slot=1 Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe Version: 102.20.0.0 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R7 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 5 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 160 = 2 * 5 * 16 Block dim: 128 Binary build log for AMD Radeon R7 200 Series: OK (0) Program build log for AMD Radeon R7 200 Series: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R7 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 5 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 160 = 2 * 5 * 16 Block dim: 128 Program build log for AMD Radeon R7 200 Series: OK (0) Prefered kernel work group size multiple: 64 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R7 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 5 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 160 = 2 * 5 * 16 Block dim: 128 Program build log for AMD Radeon R7 200 Series: OK (0) Prefered kernel work group size multiple: 64 08:26:09 (20272): called boinc_finish(0) </stderr_txt> ]]>