Task 626740564
| Name | ps_251121_input_52498_49_1 |
| Workunit | 283623101 |
| Created | 22 Nov 2025, 23:20:49 UTC |
| Sent | 24 Nov 2025, 9:10:47 UTC |
| Report deadline | 4 Dec 2025, 21:10:47 UTC |
| Received | 30 Nov 2025, 17:37:19 UTC |
| Server state | Over |
| Outcome | Success |
| Client state | Done |
| Exit status | 0 (0x00000000) |
| Computer ID | 768967 |
| Run time | 10 min |
| CPU time | 8 sec |
| Validate state | Invalid |
| Credit | 0.00 |
| Device peak FLOPS | 901.47 GFLOPS |
| Application version | Period Search Application v102.20 (opencl_102_amd_win) windows_x86_64 |
| Peak working set size | 1.59 GB |
| Peak swap size | 3.28 GB |
| Peak disk usage | 2.22 MB |
Stderr output
<core_client_version>8.0.2</core_client_version> <![CDATA[ <stderr_txt> BOINC client version 8.0.2 BOINC GPU type 'ATI', deviceId=0, slot=6 Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe Version: 102.20.0.0 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 32 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 1024 = 2 * 32 * 16 Block dim: 128 Binary build log for AMD Radeon R9 200 Series: OK (0) Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 32 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 1024 = 2 * 32 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 32 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 1024 = 2 * 32 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 32 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 1024 = 2 * 32 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 32 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 1024 = 2 * 32 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 32 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 1024 = 2 * 32 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 32 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 1024 = 2 * 32 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Platform name: AMD Accelerated Parallel Processing Platform vendor: Advanced Micro Devices, Inc. OpenCL device C version: OpenCL C 1.2 | OpenCL 1.2 AMD-APP (3240.7) OpenCL device Id: 0 OpenCL device name: AMD Radeon R9 200 Series 3GB Device driver version: 3240.7 Multiprocessors: 32 Max Samplers: 16 Max work item dimensions: 3 Resident blocks per multiprocessor: 16 Grid dim: 1024 = 2 * 32 * 16 Block dim: 128 Program build log for AMD Radeon R9 200 Series: OK (0) Prefered kernel work group size multiple: 64 Setting Grid Dim to 256 Error enqueueing kernel [ClCalculateIter1Mrqcof1Curve1]: out of resources (-5) Error enqueueing kernel: invalid/unknown error code (1) 18:37:09 (16056): called boinc_finish(0) </stderr_txt> ]]>