Task 681180876

Name ps_260430_input_41769_155_1
Workunit 309948068
Created 1 May 2026, 2:31:57 UTC
Sent 3 May 2026, 0:28:59 UTC
Report deadline 13 May 2026, 12:28:59 UTC
Received 3 May 2026, 11:20:24 UTC
Server state Over
Outcome Success
Client state Done
Exit status 0 (0x00000000)
Computer ID 752743
Run time 30 min 51 sec
CPU time 8 sec
Validate state Initial
Credit 0.00
Device peak FLOPS 988.64 GFLOPS
Application version Period Search Application v102.20 (opencl_102_amd_win)
windows_x86_64
Peak working set size 3.04 GB
Peak swap size 4.77 GB
Peak disk usage 2.04 MB

Stderr output

<core_client_version>8.2.9</core_client_version>
<![CDATA[
<stderr_txt>
BOINC client version 8.2.9
BOINC GPU type 'ATI', deviceId=0, slot=1
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Binary build log for Radeon (TM) RX 570:
OK (0)
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
BOINC client version 8.2.9
BOINC GPU type 'ATI', deviceId=0, slot=1
Application: period_search_10220_windows_x86_64__opencl_102_amd_win.exe
Version: 102.20.0.0
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
Platform name: AMD Accelerated Parallel Processing
Platform vendor: Advanced Micro Devices, Inc.
OpenCL device C version: OpenCL C 2.0  | OpenCL 2.0 AMD-APP (3584.0)
OpenCL device Id: 0
OpenCL device name: Radeon (TM) RX 570 8GB
Device driver version: 3584.0 (PAL,HSAIL)
Multiprocessors: 32
Max Samplers: 16
Max work item dimensions: 3
Resident blocks per multiprocessor: 16
Grid dim: 1024 = 2 * 32 * 16
Block dim: 128
Program build log for Radeon (TM) RX 570:
OK (0)
Prefered kernel work group size multiple: 64
Setting Grid Dim to 256
12:19:57 (36788): called boinc_finish(0)

</stderr_txt>
]]>